型号 HST1.1-9-X2
厂商 Panduit Corp
描述 HEAT SHRINK THICK ADH RED 1.1X9"
HST1.1-9-X2 PDF
代理商 HST1.1-9-X2
标准包装 10
系列 HST
类型 套管,半刚性
收缩比率 3 至 1
长度 0.750'(228.60mm,9.00")
内径 - 提供 1.100"(27.9mm)
内径 - 恢复 0.370"(9.4mm)
已恢复的墙壁厚度 0.120"(3.05mm)
材质 聚烯烃
特点 粘性内衬,阻燃
颜色
相关产品 HSG-115V-650-ND - TOOL GUN HEAT SHRINK HI TEMP 10A
同类型PDF
HST1.5-12-1 Panduit Corp HEAT SHRINK THICK WALL 1.5"X12"
HST1.5-12-5 Panduit Corp HEAT SHRINK THICK ADH BLK1.5X12"
HST1.5-48-5 Panduit Corp HEAT SHRINK THICK ADH BLK1.5"X4'
HST1.5-9-X Panduit Corp HEAT SHRINK THICK ADH BLK 1.5X9"
HST2.0-12-2 Panduit Corp HEAT SHRINK THICK WALL 2.0"X12"
HST2.0-48-2 Panduit Corp HEAT SHRINK THICK ADH BLK 2"X4'
HST2.0-9-5Y Panduit Corp HEAT SHRINK THICK ADH BLK 2"X9"
HST3.0-12-2 Panduit Corp HEAT SHRINK THICK ADH BLK 3"X12"
HST3.0-48-2 Panduit Corp HEAT SHRINK THICK ADH BLK 3"X4'
HSTL16918DGG,112 NXP Semiconductors IC MEMORY ADDRESS LATCH 48TSSOP
HSTL16918DGG,118 NXP Semiconductors IC MEMORY ADDRESS LATCH 48TSSOP
HSTL16918DGG,512 NXP Semiconductors IC MEMORY ADDRESS LATCH 48TSSOP
HSTL16918DGG,518 NXP Semiconductors IC MEMORY ADDRESS LATCH 48TSSOP
HSTL16919DGG,112 NXP Semiconductors IC MEMORY ADDRESS LATCH 48TSSOP
HSTL16919DGG,118 NXP Semiconductors IC MEMORY ADDRESS LATCH 48TSSOP
HSTT05-48-Q Panduit Corp HEAT SHRINK DIA BLK 3/64" X 4'
HSTT05-48-QC Panduit Corp HEAT SHRINK CLR 3/64" X 4'
HSTT05-CC Panduit Corp HEAT SHRINK CLR 3/64" X 100'
HSTT05-M Panduit Corp HEAT SHRINK BLK 3/64" X 1M'
HSTT05-Q Panduit Corp HEAT SHRINK DIA BLK3 /64" X 25'